Hello all,
I'm in search of expert advice regarding the usage of the port in the DL series embedded 4-Port NIC when bonding is used.
I would like to know if the 4 port are serviced by on single chip, 2 chips or 4 chips.
I case the ports are services by 2 chips then the question would be how these are groupped.
I'm trying to maximize the redundancy configuration by making sure I use separate chips for each of the bonding slaves.